The BOFA Temperature control unit (TCU) has been designed to meet a very specific process requirement within the electronics sector. The reliable placement of surface mount devices during PCB assembly requires that during the initial printing stage the solder paste is maintained at a temperature which ensures optimum performance.
With assembly now on a global basis the variation of local climate and factory conditions means that this optimum level cannot be maintained without some form of intervention.
The design of the TCU includes cooling and heating elements which ensure that the temperature within the printing environment is maintained within 1ºC of the optimum paste performance temperature regardless of whether the factory ambient is above or below this level.
Heaters and refrigerated cooling providing a consistant temperature within the print area, accurate to within 1ºC.
Interfacing provides automatic and time delay shutdown when the printer is switched off or covers are open.
Digital programmer with graphic display.
Process monitoring via temperature sensors that can be strategically mounted within the printer.
To prevent process contamination, the conditioned air is passed through a filter before entering the TCU.
Positive pressure is maintained within the printer to prevent further contamination.
A four colour beacon provides operating condition status.
Condensate produced is gravity fed to an easily removed 5 litre container or piped to an external drain.
Two capacitive level sensors monitor the condensate level.
Fail-safe condensate sensor with TCU shutdown in the base of the unit to detect water in the event that the condensate container has not been re-fitted after emptying.
An additional silencer can be retro-fitted if required.
Compact and mobile unit with a small footprint.
Single phase supply.
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